Inductively-Coupled Plasma Reactive Ion Etching System

Oxford Instruments, PlasmaLab System 100 Modus Operandi:Service-ModeContamination category:Chamber 1: AChamber 2: BSample-size:up to 6″ substrates; 6″ dummy wafer for samples FOM-Name:- AMO – RIE1Location:AMO Tool manager: AMO Instruction video: Not available Tool description: ICP-RIE; automatic 2 chamber system; mainly chlorine and bromine based chemistry; process gases: HBr, BCl3, Cl2, C4F8, CHF3, CF4, SF6, O2, N2, […]

Read More

Atomic Layer Deposition Tool

Oxford Instruments, FlexAL Modus Operandi:Service-ModeContamination category:CSample-size:up to 8″ wafers; 8″ dummy wafer for samples FOM-Name:- AMO – ALDLocation:AMO Tool manager: AMO Instruction video: Not available Tool description: Materials: AlN, Al2O3, TaN, TiN; process gases: N2, H2, O2, SF6, Ar, NH3, H2O; Wafer stage temperature up to 400°C

Read More

Wet Oxidation Furnace

Centrotherm Modus Operandi:Service-ModeContamination category:ASample-size:up to 200×6″ or up to 50×8″ wafers per run; 15×15 cm tray for samples FOM-Name:- AMO – Dry Oxidation FurnaceLocation:AMO Tool manager: AMO Instruction video: Not available Tool description: 3″ – 8″ Centrotherm furnace; dry oxidation up to 300 nm

Read More

Dry Oxidation Furnace

Centrotherm Modus Operandi:Service-ModeContamination category:ASample-size:up to 200×6″ or up to 50×8″ wafers per run; 15×15 cm tray for samples FOM-Name:- AMO – Dry Oxidation FurnaceLocation:AMO Tool manager: AMO Instruction video: Not available Tool description: 3″ – 8″ Centrotherm furnace; dry oxidation up to 300 nm

Read More