Pfeiffer Vacuume, Classic 580 Modus Operandi:Service-ModeContamination category:CSample-size:4″-, 5″- and 6″-wafers; sample size up to 6″ FOM-Name:- AMO – EvaporatorLocation:AMO Tool manager: AMO Instruction video: Not available Tool description: 6″ e-beam and resistive evaporator; Materials: Al, Cr, SiO2, Ti, Ta2O5, etc.; process gases: N2, O2
Category: Available Processing Tools
Rapid Thermal Processing Furnace
Jipelec, JetFirst Modus Operandi:Service-ModeContamination category:CSample-size:up to 6″ wafers; 6″ dummy wafer for samples FOM-Name:- AMO – RTPLocation:AMO Tool manager: AMO Instruction video: Not available Tool description: 6″ Rapid Thermal Annealing system up to 1100°C; process gases H2, N2, Ar
Low Pressure Chemical Vapour Deposition Furnace for Low Temperature Silicon Dioxide
Centrotherm Modus Operandi:Service-ModeContamination category:ASample-size:up to 25 wafers per run; 9 samples (max. 2×2 cm) FOM-Name:- AMO – LPCVD-LTOLocation:AMO Tool manager: AMO Instruction video: Not available Tool description: LTO (low temp. SiO2); 425°C; SiH4 and O2 process; up to 500 nm
Low Pressure Chemical Vapour Deposition Furnace for Polycrystalline Silicon
Centrotherm Modus Operandi:Service-ModeContamination category:ASample-size:up to 25 wafers per run; 15×15 cm tray for samples FOM-Name:- AMO – LPCVD-PolyLocation:AMO Tool manager: AMO Instruction video: Not available Tool description: Polysilicon; 620°C; SiH4 process; up to 500 nm
Wet Oxidation Furnace
Centrotherm Modus Operandi:Service-ModeContamination category:ASample-size:up to 200×6″ or up to 50×8″ wafers per run; 15×15 cm tray for samples FOM-Name:- AMO – Dry Oxidation FurnaceLocation:AMO Tool manager: AMO Instruction video: Not available Tool description: 3″ – 8″ Centrotherm furnace; dry oxidation up to 300 nm
Dry Oxidation Furnace
Centrotherm Modus Operandi:Service-ModeContamination category:ASample-size:up to 200×6″ or up to 50×8″ wafers per run; 15×15 cm tray for samples FOM-Name:- AMO – Dry Oxidation FurnaceLocation:AMO Tool manager: AMO Instruction video: Not available Tool description: 3″ – 8″ Centrotherm furnace; dry oxidation up to 300 nm
Wet Bench for Standard Cleaning (RCA)
Arias Modus Operandi:Service-ModeContamination category:ASample-size:dedicated holder for 2×2 cm2 and 3×3 cm2; 4″, 5″, 6″, 8″ wafers FOM-Name:- AMO – Wet Bench RCALocation:AMO Tool manager: AMO Instruction video: Not available Tool description: Single wafer and batch; cleaning processes
Wet Bench for Lithography Processes
Arias Modus Operandi:Service-ModeContamination category:B Sample-size:wide range of sample and wafer sizes up to 8″ FOM-Name:- AMO – Wet Bench LithographyLocation:AMO Tool manager: AMO Instruction video: Not available Tool description: Single wafer, batch and samples; cleaning and resist processes
Wet Bench for Imprint Processes
Arias Modus Operandi:Service-ModeContamination category:B and C (dedicated halves)Sample-size:pieces – 8″ wafers FOM-Name:- AMO – Went Bench ImprintLocation:AMO Tool manager: AMO Instruction video: Not available Tool description: wet bench right (class C), carrier left (class B)
SCIL UV Nanoimprint Lithography System
SÜSS MicroTec, MA8 Gen3 Modus Operandi:Service-ModeContamination category:BSample-size:2″ – 8″ wafers FOM-Name:- AMO – SCIL UV NanoimprintLocation:AMO Tool manager: AMO Instruction video: Not available Tool description: SCIL 2″-8″ UV-Nanoimprint Lithography