All Processing Tools

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  • Low Pressure Chemical Vapour Deposition Furnace for Polycrystalline Silicon

    Centrotherm

    Usage

    • Modus Operandi:
      Service-Mode
    • Contamination category:
      A
    • Sample-size:
      up to 25 wafers per run; 15x15 cm tray for samples

    FOM-Name and Location

    • FOM-Name:
      - AMO - LPCVD-Poly
    • Location:
      AMO

    Resources

    • Tool manager:
      AMO
    • Instruction video:
      Not available
    • Tool description:
      Polysilicon; 620°C; SiH4 process; up to 500 nm
    Continue reading →

  • Photolithography System (Mask Aligner)

    SÜSS MicroTec, MA4

    Usage

    • Modus Operandi:
      User-mode
    • Contamination category: A,B,C if appropriate chucks and masks are used
    • Sample-size:
      Pieces ... 4″

    FOM-Name and Location

    • FOM-Name:
      – IHT – Optical Lithography (MA4)
    • Location: WSH, Room 24B103

    Resources

    Continue reading →

  • Photolithography System

    SÜSS MicroTec, MJB3

    Usage

    • Modus Operandi:
      User-mode
    • Contamination category: B, C
    • Sample-size:
      Pieces ... 3″
    Mask Aligner MJB3

    FOM-Name and Location

    • FOM-Name:
      - Physik - Photolithography System (MJB3)
    • Location:
      Physikzentrum, Room 28A313

    Resources

    • Tool manager:
      Arne Hollmann
    • Instruction video:
      Open video
    • Tool description:
      SÜSS MicroTec, MJB3
    Continue reading →

  • Photolithography System (Mask Aligner / Bond Aligner)

    SÜSS MicroTec, MA/BA6

    Usage

    • Modus Operandi:
      User-mode
    • Contamination category: A,B,C if appropriate chuck and masks are used
    • Sample-size:
      Pieces ... 6″ wafer

    FOM-Name and Location

    Resources

    Continue reading →

  • Plasma-Enhanced Chemical Vapor Deposition System

    Oxford Instruments, PlasmaLab 80 Plus

    Usage

    • Modus Operandi:
      ...
    • Contamination category: C
    • Sample-size:
      Pieces ... 4″
    Oxford PlasmaLab 80 PECVD

    FOM-Name and Location

    • FOM-Name:
      PECVD (Petzi)
    • Location:
      CMNT, Room 004

    Resources

    • Tool manager:
      Jan Gruis
    • Instruction video:
      Open video
    • Tool description:
      Oxford Instruments, PlasmaLab 80 Plus
      Parallel-plate PECVD
      Process gases: SiH4, O2, NH3
    Continue reading →

  • Photolithography System (Mask Aligner)

    EVG, 420

    Usage

    • Modus Operandi:
      Service-Mode
    • Contamination category:
      C
    • Sample-size:
      from samples of 10×10 mm² up to 6" wafers

    FOM-Name and Location

    • FOM-Name:
      - AMO - Mask Aligner (EVG 420)
    • Location:
      AMO

    Resources

    • Tool manager:
      AMO
    • Instruction video:
      Not available
    • Tool description:
      6" semi-automatic mask aligner; 2 µm resolution
    Continue reading →

  • Photolithography System (Mask Aligner)

    SÜSS MicroTec, MA6

    Usage

    • Modus Operandi:
      Service-Mode
    • Contamination category:
      C
    • Sample-size:
      100 mm, 150 mm Wafer

    FOM-Name and Location

    • FOM-Name:
      - Mask Aligner MA 6
    • Location:
      ZMNT, Room 009

    Resources

    • Tool manager:
      Jochen Heiss
    • Instruction video:
      Not available
    • Tool description:
      Mask Aligner and Bond Aligner, UV NIL Tooling
    Continue reading →

  • Photolithography System (Stepper)

    Canon, FPA 3000 i5+

    Usage

    • Modus Operandi:
      Service-Mode
    • Contamination category:
      B
    • Sample-size:
      only 6" wafers; no samples

    FOM-Name and Location

    • FOM-Name:
      - AMO - Stepper
    • Location:
      AMO

    Resources

    • Tool manager:
      AMO
    • Instruction video:
      Not available
    • Tool description:
      6" i-line Stepper with 0.5 μm resolution
    Continue reading →

  • Plasma Asher

    Alpha Plasma, PP35

    Usage

    • Modus Operandi:
      User-mode
    • Contamination category: C
    • Sample-size:
      Pieces ... 4″
    Plasma Asher

    FOM-Name and Location

    • FOM-Name:
      - Physik - Plasma Asher
    • Location:
      Physikzentrum, Room 28A313

    Resources

    • Tool manager:
      Lars Schreiber
    • Instruction video:
      Open video
    • Tool description:
      Alpha Plasma, PP35
    Continue reading →

  • Plasma Asher

    Tegal, 915

    Usage

    • Modus Operandi:
      User-mode
    • Contamination category: B,C (B if appropriate handling wafer is used)
    • Sample-size:
      Pieces ... 6″ wafers
    O2 Plasma Asher

    FOM-Name and Location

    • FOM-Name:
      N.N.
    • Location:
      CMNT, Room 009

    Resources

    Continue reading →


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