All Processing Tools

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  • Sputtering System

    Nordiko, NS 2550 Berlin

    Usage

    • Modus Operandi:
      Service-Mode
    • Contamination category:
      C
    • Sample-size:
      100 mm, 150 mm Wafer

    FOM-Name and Location

    • FOM-Name:
      - Nordiko (Berlin)
    • Location:
      ZMNT, Room 007

    Resources

    • Tool manager:
      Jochen Heiss
    • Instruction video:
      Not available
    • Tool description:
      Targets: Ti, Au, changing, on demand
    Continue reading →

  • Sputtering System

    Nordiko, NS 2550 Duisburg

    Usage

    • Modus Operandi:
      Service-Mode
    • Contamination category:
      C
    • Sample-size:
      100 mm, 150 mm Wafer

    FOM-Name and Location

    • FOM-Name:
      - Nordiko (Duisburg)
    • Location:
      ZMNT, Room 007

    Resources

    • Tool manager:
      Jochen Heiss
    • Instruction video:
      Not available
    • Tool description:
      Targets: Ti, Pl, Iridium, on demand
    Continue reading →

  • Wafer Bonder

    SÜSS MicroTec, SB6e

    Usage

    • Modus Operandi:
      User-mode
    • Contamination category: B,C if appropriate handling tools are used
    • Sample-size:
      6″ wafers
    Wafer Bonder

    FOM-Name and Location

    Resources

    • Tool manager:
      Jochen Heiss
    • Instruction video:
      Open video
    • Tool description:
      SÜSS MicroTec, SB6e
    Continue reading →

  • Wet Bench for Imprint Processes

    Arias

    Usage

    • Modus Operandi:
      Service-Mode
    • Contamination category:
      B and C (dedicated halves)
    • Sample-size:
      pieces - 8" wafers

    FOM-Name and Location

    • FOM-Name:
      - AMO - Went Bench Imprint
    • Location:
      AMO

    Resources

    • Tool manager:
      AMO
    • Instruction video:
      Not available
    • Tool description:
      wet bench right (class C), carrier left (class B)
    Continue reading →

  • Wet Bench for Lithography Processes

    Arias

    Usage

    • Modus Operandi:
      Service-Mode
    • Contamination category:
      B
    • Sample-size:
      wide range of sample and wafer sizes up to 8"

    FOM-Name and Location

    • FOM-Name:
      - AMO - Wet Bench Lithography
    • Location:
      AMO

    Resources

    • Tool manager:
      AMO
    • Instruction video:
      Not available
    • Tool description:
      Single wafer, batch and samples; cleaning and resist processes
    Continue reading →

  • Wet Bench for Resist Coating

    Arias

    Usage

    • Modus Operandi:
      User-Mode
    • Contamination category:
      C
    • Sample-size:
      100 mm, 150 mm Wafer

    FOM-Name and Location

    • FOM-Name:
      - Litho-Bench 1
    • Location:
      ZMNT, Room 009

    Resources

    • Tool manager:
      Jochen Heiss
    • Instruction video:
      Not available
    • Tool description:
      Hotplate small, medium, big (Gestigkeit), Spin Coater RC8 (SÜSS MicroTec, RC8 )
    Continue reading →

  • Wet Bench for Resist Coating and Development

    Arias

    Usage

    • Modus Operandi:
      User-Mode
    • Contamination category:
      C
    • Sample-size:
      100 mm, 150 mm Wafer

    FOM-Name and Location

    • FOM-Name:
      - Litho-Bench 2
    • Location:
      ZMNT, Room 009

    Resources

    • Tool manager:
      Jochen Heiss
    • Instruction video:
      Not available
    • Tool description:
      Hotplate small, medium, big (Gestigkeit), Spin Coater (Sawatec, SM 180)
    Continue reading →

  • Wet Bench for Standard Cleaning (RCA)

    Arias

    Usage

    • Modus Operandi:
      Service-Mode
    • Contamination category:
      A
    • Sample-size:
      dedicated holder for 2x2 cm2 and 3x3 cm2; 4", 5", 6", 8" wafers

    FOM-Name and Location

    • FOM-Name:
      - AMO - Wet Bench RCA
    • Location:
      AMO

    Resources

    • Tool manager:
      AMO
    • Instruction video:
      Not available
    • Tool description:
      Single wafer and batch; cleaning processes
    Continue reading →

  • Wet Bench Fume Hood

    Arias

    Usage

    • Modus Operandi:
      User-mode
    • Contamination category: A,B (right side),C (left side) if appropriate labware and beakers are used
    • Sample-size:
      Pieces ... 6″ wafers
    Acid Hood

    FOM-Name and Location

    Resources

    • Tool manager:
      Birger Berghoff
    • Instruction video:
      Open video
    • Tool description: 
    Continue reading →

  • Wet Bench for Resist and HMDS Coating

    Arias

    Usage

    • Modus Operandi:
      User-mode
    • Contamination category: A, B, C if appropriate handle wafer and chucks are used
    • Sample-size:
      Pieces ... 6″ wafer
    Resist Coating including HMDS

    FOM-Name and Location

    Resources

    • Tool manager:
      Birger Berghoff
    • Instruction video:
      Open video
    • Tool description:
    Continue reading →


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