Oxford Instruments, PlasmaPro 100 Cobra Modus Operandi: User-mode Contamination category: A, B Sample-size: Pieces … 6″ wafers FOM-Name: ALE for Si-based Materials (Oxford Instruments, PlasmaPro100) Location: CMNT, Room 007 Tool manager: Birger Berghoff Instruction video: Open video Tool description: Atomic-layer etching system for Si-based Materials. Available etching processes: Si, SiO2. Available gases: SF6, CH4, CHF3, O2, […]
Category: Available Processing Tools
Photolithography System (Mask Aligner)
SÜSS MicroTec, MA6 Modus Operandi:Service-ModeContamination category:CSample-size:100 mm, 150 mm Wafer FOM-Name:- Mask Aligner MA 6 Location:ZMNT, Room 009 Tool manager: Jochen Heiss Instruction video: Not available Tool description: Mask Aligner and Bond Aligner, UV NIL Tooling
Wet Bench for Resist Coating and Development
Arias Modus Operandi:User-ModeContamination category:CSample-size:100 mm, 150 mm Wafer FOM-Name:- Litho-Bench 2Location:ZMNT, Room 009 Tool manager: Jochen Heiss Instruction video: Not available Tool description: Hotplate small, medium, big (Gestigkeit), Spin Coater (Sawatec, SM 180)
Wet Bench for Resist Coating
Arias Modus Operandi:User-ModeContamination category:CSample-size:100 mm, 150 mm Wafer FOM-Name:- Litho-Bench 1Location:ZMNT, Room 009 Tool manager: Jochen Heiss Instruction video: Not available Tool description: Hotplate small, medium, big (Gestigkeit), Spin Coater RC8 (SÜSS MicroTec, RC8 )
Electron-Beam Evaporation System
Leybold, A700QE Modus Operandi:Service-ModeContamination category:CSample-size:100 mm, 150 mm Wafer FOM-Name:- Box Coater Leybold A700QE (Electron-Beam)Location:ZMNT, Room 007 Tool manager: Jochen HeissInstruction video: Not availableTool description:Materials: Au, Cr, Ti, Cu, Al, on demand
Sputtering System
Nordiko, NS 2550 Duisburg Modus Operandi:Service-ModeContamination category:CSample-size:100 mm, 150 mm Wafer FOM-Name:- Nordiko (Duisburg)Location:ZMNT, Room 007 Tool manager: Jochen HeissInstruction video: Not availableTool description:Targets: Ti, Pl, Iridium, on demand
Sputtering System
Nordiko, NS 2550 Berlin Modus Operandi:Service-ModeContamination category:CSample-size:100 mm, 150 mm Wafer FOM-Name:- Nordiko (Berlin)Location:ZMNT, Room 007 Tool manager: Jochen Heiss Instruction video: Not available Tool description: Targets: Ti, Au, changing, on demand
Reactive-Ion Etching System
Oxford Instruments, RIE 80 Modus Operandi:User-ModeContamination category:CSample-size:100 mm, 150 mm Wafer FOM-Name:- RIE (RIE 80)Location:ZMNT, Room 006 Tool manager: Jochen HeissInstruction video: Not availableTool description:Etching gases: N2, O2, CHF3, CF4, SF6, Ar
Reactive-Ion Etching System
Tegal, 901 Modus Operandi:User-ModeContamination category:CSample-size:100 mm Wafer FOM-Name:- RIE (Tegal 901)Location:ZMNT, Room 006 Tool manager: Jochen HeissInstruction video: Not availableTool description:Etching gases: N2, O2, CHF3, CF4, SF6, Ar
Inductively-Coupled Plasma Reactive Ion Etching System
Oxford Instruments, PlasmaLab System 100 Modus Operandi:Service-ModeContamination category:Chamber 1: AChamber 2: BSample-size:up to 6″ substrates; 6″ dummy wafer for samples FOM-Name:- AMO – RIE1Location:AMO Tool manager: AMO Instruction video: Not available Tool description: ICP-RIE; automatic 2 chamber system; mainly chlorine and bromine based chemistry; process gases: HBr, BCl3, Cl2, C4F8, CHF3, CF4, SF6, O2, N2, […]