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Reactive-Ion Etching System

December 19, 2016December 19, 2016 Joachim Knoch Available Processing Tools, Dry Etching

Reactive-Ion Etching System

Oxford Instruments, RIE 80

Usage

  • Modus Operandi:
    User-Mode
  • Contamination category:
    C
  • Sample-size:
    100 mm, 150 mm Wafer

FOM-Name and Location

  • FOM-Name:
    - RIE (RIE 80)
  • Location:
    ZMNT, Room 006

Resources

  • Tool manager:
    Jochen Heiss
  • Instruction video:
    Not available
  • Tool description:
    Etching gases: N2, O2, CHF3, CF4, SF6, Ar

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Reactive-Ion Etching System
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