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Wafer Bonder (SB6e)

April 26, 2016July 17, 2017 Joachim Knoch Available Processing Tools, Wafer Bonding

Wafer Bonder

SÜSS MicroTec, SB6e

Usage

  • Modus Operandi:
    User-mode
  • Contamination category: B,C if appropriate handling tools are used
  • Sample-size:
    6″ wafers
Wafer Bonder

FOM-Name and Location

  • FOM-Name:
    N.N.
  • Location:
    CMNT, Room 006

Resources

  • Tool manager:
    Jochen Heiss
  • Instruction video:
    Open video
  • Tool description:
    SÜSS MicroTec, SB6e

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